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双语推荐:导热

用共混挤出法制备导热尼龙(PA)66复合材料,研究了导热填料种类、含量及与玻璃纤维复配对复合材料导热系数的影响。结果表明,在选用的3种导热填料中以Al填充PA66的效果最好;当复合材料中填料粒子用量达到一定含量时,填料之间形成特殊的导热通路,提高复合材料的导热性能;随着填料含量的增加,复合材料的导热性能上升,当Al含量为45%时,复合材料的导热系数为0.778 W/(m·K);玻璃纤维与导热填料的共同作用使体系导热系数有一定提高。
Thermal conductivity PA66 composites reinforced by metal powder and oxide were prepared by blending extrusion method.The effects of filler variety and content,combination use with glass fiber on the thermal conductivity coefficient of composites were studied.The results showed that the composite filled with Al had best thermal conductivity. When the filler content reached a certain amount,the special conduction path could be formed between the filler,which could improve the thermal conductivity of composite.Increasing filler content could improve the thermal properties of composites,and PA66 composites with the thermal conductivity coefficient of 0.778 W/(m · K) was obtained when Al content was 45%.The combination use of glass fiber and thermal conductive filler could enhance the thermal conductivity.

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综述了高导热型聚合物基纳米复合材料的导热机理、填充型复合材料的导热模型、高导热型聚合物基复合材料及其导热填料的研究现状。最后,提出了高导热型聚合物基纳米复合材料存在的问题,并对其发展方向进行了展望。
The thermal conducting mechanism and the theoretical models were introduced. The development of thermally conductive polymer based composites and their thermally conductive or hybrid fillers was summarized. Finally,the existent problems in the high thermally conductive polymer based composites were discussed and some suggestions were advocated.

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天然气水合物导热系数的研究对于模拟自然界天然气水合物的成藏和天然气水合物勘探、开采具有重要意义。本文介绍了获取天然气水合物导热系数的实验测试和模拟计算方法,分析了气体水合物导热特性、导热机理以及水合物复合体系导热。总结了水合物导热规律,即外界温压条件和晶穴占有率对水合物的导热产生影响,且水合物的导热具有相似的温度压力依赖关系,并呈玻璃体的导热特性。水合物玻璃体导热特性由水合物笼型结构决定,而客体分子的存在强化了水合物导热的玻璃体属性。指出非稳态下天然气水合物导热性能变化研究对分析天然气水合物在常压下的稳定性、确定甲烷水合物等最佳储存温度、从导热角度探讨自保护效应机理等具有重要意义。
The study on gas hydrate thermal conductivity is significant for the gas hydrate reservoirs, exploration and mining. Experimental and measuring technique and modeling method for the gas hydrate thermal conductivity are presented. Thermal conduction features and mechanisms for gas hydrate, as well as thermal conductivity of complex system are reviewed. The thermal conductivity laws of gas hydrate are summarized. The outside thermobaric condition and cage occupancy effect on the gas hydrate heat performance. The thermal conduction of these gas hydrates, with gassy behavior, has similar temperature dependence. The gassy property of the thermal conduction is determined by framework of cage and reinforced by the guest molecules enclosed in the cages. It is figured out that studies on gas hydrates in unsteady-state with thermal properties that vary as a function of time are important. It is benefit to reveal gas hydrate stability under atmospheric conditions, to identify optimal st

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概述了导热硅脂的组成和导热机理,着重介绍了从填料上改善导热硅脂导热性能的主要途径.阐述了导热硅脂的应用情况,并对今后的研究方向进行了展望。
The composition and thermal conductivity mechanism of thermal conductive silicone greases were reviewed .The improvement of thermal conductive silicone grease on the conducting filler was focused . The applications and future development of thermal conductive silicone grease were also discussed .

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对用于高热流密度分布式点热源的散热的预埋热管铝基导热板进行了传热性能试验研究,结合模拟仿真,通过求解导热反问题的方法求得热管导热板的当量导热系数。研究结果表明,采用的热管导热板具有优良的热传导能力,当量导热系数随传输功率的增大而降低,当量导热系数范围为1 100~7 600 W/(m.K)。
In this paper,thermal behavior of heat pipe embedded Al plates used for cooling of high heat flux distributed spot heat source is investigated by experiment.A method of solving inverse problem of conductivity is presented to investigate the effective conductivity of heat pipe embedded Al plates.The results indicate that heat pipe embedded Al plates have very high thermal conductance.The effective conductivity decreases as the heat load increases,its range is 1 100~7 600 W/(m·K).

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文中研究了不同种类硅油、不同金属氧化物导热填料及其颗粒直径大小分布、不同偶联剂种类等因素对导热硅脂产品的接触热阻、导热系数、界面厚度、粘度、耐渗油性等性能的影响。结果证明:二甲基硅油与球形氧化铝导热填料搭配使用可以获得更高的填料填充量,通过加入偶联剂可大大降低导热硅脂产品的粘度并提高导热硅脂的耐渗油性,而适中的导热填料颗粒大小分布以及较小的界面厚度可以得到高导热系数以及超低接触热阻的导热硅脂产品。
The performance of thermal conductive grease was studied in this paper. The effeact of different silicone oil type, filler type and particle size distribution, coupling agent on thermal conductive grease system had been investigated. The results showed that using polydimethylsiloxane and aluminum oxide may obtain a higher filler content, and using coupling agent can decrease the viscosity and improve the anti-bleeding performance of thermal grease. Moderate filler particle size distribution may obtain higher thermal conductivity and lower contact thermal resistance.

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应用瞬态热线法导热系数测量装置,测定了含硼炉渣的导热系数。获得了导热系数与温度的关系,及组成对导热系数的影响。在低温区导热系数随着温度的升高而呈直线形式略有增加;在高温区导热系数随着温度的升高而迅速降低。在所研究的组成中,随着碱度R=CaO/SiO2的增加,含硼炉渣的导热系数减少;在碱度R=CaO/SiO不变时,随着MgO含量的增加,含硼炉渣的导热系数增加;随着B2O3含量的增加,导热系数呈现出不规则的变化。为提高含硼炉渣硼的提取率提供了基础数据和依据。
The transient heat wire method was applied to measure the thermal conductivity of the boron-containing slag, and the relationship of thermal conductivity with temperature and composition was obtained. The thermal conductivity increased slightly with the elevation of temperature in the low temperature zone, the thermal conductivity decreased rapidly with the elevation of temperature in the high temperature zone. The thermal conductivity of the boron-containing slag decreased with the increase of R=CaO/SiO2. The thermal conductivity of the boron-containing slag increased with the increase of MgO content when R=CaO/SiO2 was constant. It provided basic data and reference for increasing rate of extraction of the B2O3 bearing slag.

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探讨了材料类型、密度、含水率、测试温度等因素对硅酸钙板导热系数的影响。结果表明,硅酸钙板的结构类型不同,其导热系数会存在较大差别;密度越小,其孔隙率相对越大,导热系数值就会越小;导热系数随着含水率的增加出现先缓慢增加再迅速增加后趋于平稳的趋势;绝干或含水率较低情况下,其导热系数随着平均温度的升高而增大,且密度等级越低,增幅越大,但由于加热法测量导热系数的过程中存在湿分迁移效应,当含湿量超过一定值时(约8%~10%),测试平均温度越高,其导热系数反而越小。
The effects of material type, density, moisture content, test temperature, etc. on thermal conductivity of cal-cium silicate board are studied. The results show that its thermal conductivity differs according to its structure and type. The smaller the density, the greater the relative porosity, which leads to the smaller thermal conductivity. The thermal con-ductivity increases slowly at first and then rapidly increases and last tends to be constant with the increase of moisture content. Under the condition of absolutely dry or low moisture content of the sample, the thermal conductivity increases with the increase of the average temperature, and the lower the density grade, the faster the growth of the thermal conduc-tivity is. However, due to the moisture migration, the higher the average test temperature, the smaller its thermal conductiv-ity is, when the moisture content exceeds a certain value (about 8%to 10%).

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主要综述了高导热率低膨胀加成型硅橡胶及导热填料的研究进展。首先介绍了常见的导热填料及其基本性能,主要包括金属类、氧化物类、氮化物类、碳化物类等;详细描述了各类填料的性能特点,并指出了填料基本性能对导热系数的影响,主要包括填料的比例、尺寸、尺寸分布、形状及填料的表面性质等。其次详细介绍了提高导热系数的基本途径,主要包括导热机理介绍;基体材料研究;研发新型高性能导热填料;进行导热填料表面改性;对硅橡胶成型工艺进行优化等;然后介绍了降低热膨胀系数的一些基本途径,主要包括无机纳米粒子改性等。最后指出了目前该研究领域存在的一些基本问题及解决思路,并对未来的发展方向进行了展望。
Advances in the high thermal conductivity and low expansion rate silicone rubber and thermally con-ductive filler were summarized.First,the common thermally conductive filler and basic properties of thermally conductive filler were introduced,including metals,oxides,nitrides,carbides,etc..And the performance characteristics of various types of thermally conductive filler was described in detail and pointed out the influ-ence of the basic performance of the thermal conductivity on thermal conductivity,including filler ratio,size, size distribution,shape and surface properties of the filler and so on.Followed by a detailed description of the basic ways to improve thermal conductivity were given,including introduction of thermal conductivity mecha-nism;matrix materials research;development of new high-performance thermally conductive filler;conduct thermally conductive filler surface modification;silicone rubber molding process optimization,etc..Then some basic ways to reduce th

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铝基覆铜板作为电子元器件的载体,以其优异的散热性能,广泛应用于LED、汽车、电视、电源等领域。但由于铝基覆铜板的导热绝缘层附着力差,且导热绝缘层本身韧性低,机械加工时容易出现导热绝缘层崩裂、分层的现象,这是铝基覆铜板开发及制作过程中面临的最大难题之一。本文采用柱轴弯曲试验来评估导热绝缘层的韧性及附着力,并分析了影响铝基覆铜板导热绝缘层韧性及附着力的因素,从试验条件、铝板表面处理方式、导热绝缘层厚度、导热绝缘层配方等方面进行对比,评估不同因素对韧性及附着力的影响情况。
Aluminum base copper clad laminate as the carrier of electronic components, with its excellent thermal performance, is widely used in LED, automotive, TV, power supply etc.. But the insulating thermal conductive layer of aluminum base copper clad laminate has poor adhesion and toughness, it is prone to fall off while machining, which is one of the most dififcult troubles on aluminum base copper clad laminate. In this paper, bend test (cylindrical mandrel) was used to evaluate the toughness and adhesion of insulating thermal conductive layer, and analyzed on factors influencing toughness and adhesion of insulating thermal conductive layer. Then contrast from the test condition, aluminum surface treatment, thickness and formula of insulating thermal conductive laye etc., evaluating the effect on the toughness and adhesion.

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